b - 2006 05 - apr. LG2041-PF LG2041-PF round type led lamps data sheet doc. no : qw0905- rev. : date : ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
1/5 page LG2041-PF part no. ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 60 -60 75% 100%50%25% 0 25%75% 50%100% -30 30 0 0.5 typ 25.0min 2.54typ 1.0min 4.2 5.2 3.0 4.0 1.5max + -
part no. absolute maximum ratings at ta=25 LG2041-PF part no note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) forward current peak forward current duty 1/10@10khz operating temperature storage temperature reverse current @5v power dissipation peak wave length pnm material green emitted gap565 lens green transparent color viewing angle 2 1/2 (deg) spectral halfwidth nm luminous intensity @10ma(mcd) forward voltage @20ma(v) 30 min. 2.6 max. 30 1.7 min. typ. 65 30 tstg ir t opr -40 ~ +100 10 -40 ~ +85 a i f pd i fp parameter symbol ma ma mw ratings unit ligitek electronics co.,ltd. property of ligitek only 2/5 page 30 100 120 g LG2041-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. 3/5 LG2041-PF
260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 page 4/5 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LG2041-PF 60 seconds max
part no. page 5/5 ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. LG2041-PF
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